14 | 06 | 2009
Wire Bondable Chip Resistor-WB Series Print
Chip Resistor - Chip Resistor - Category
Written by WB Series   
Sunday, 18 May 2008 11:27

  Wire Bondable Chip Resistor-WB Series

   Thin Flim Chip Resistor  Wire Bondable Chip Resistor-WB Serie

Features Applications 
Thin film passivated NiCr resistive elementLED constant current application  
Tolerance from ±0.1% ~ 10%  Medical Equipment  
Extremely Low TCR from ±25 ~ 100ppm/℃Testing / Measurement Equipment  
Wide Resistance RangeHybrid chip on board circuits 
    Multi chip module(MCM) package  
    Integrated MMIC  
           
           
Part Numbering         
WB 02 D T D1000 AA   
(1)(2)(3)(4)(5)(6)(7)(8)   
           
1). Product TypeWB Wire Bondable Chip Resistor 5). TCR D  ±50PPM/℃
2). Dimensions (L×W)WB01 0.6×0.30mm 0201   E  ±100PPM/℃
WB02 1.0×0.50mm 0402  6). Resistance 0100  10Ω
WB03 1.6×0.80mm 0603   1000  100Ω
3). Resistance Tolerance B  ±0.1%   2201  2200Ω
 D  ±0.5%   1002  10000Ω
 F  ±1%  7).Construction A  Two Bonding Pads
 J  ±5%   B  Single Bonding Pads
 K  ±10%  8).Electrode N  Ni / Au
4). Packaging T  Taping Reel   A  Aluminum
 B  Bulk       
           
Dimensions          
Size

L

W

T

D1

 
 0201  0.6±0.05  0.30±0.05  0.25±0.05  0.15±0.05
 0402  1.0±0.05  0.50±0.05  0.30±0.05  0.20±0.10
 0603  1.55±0.10  0.80±0.10  0.45±0.10  0.30±0.20
           
Standard Electrical Specifications        

Type

Rating

Operating

Max.Voltage

Max. OV.

Tolance

Resistance

TCR(PPM/℃)

 

 

WB01 (0201)

1/32W

-55 ~ +155℃

15V

30V

±0.5%, ±1%

50Ω~42KΩ

±50 ,±100 ,±25  

 

 

  ±5% ,±10%

 

 

±0.1%

 

 

±0.5%

 

 

WB02 (0402)

1/16W

-55 ~ +155℃

25V

50V

±1%

10Ω~100KΩ

±50 ,±100 ,±25  

 

 

±5%

 

 

±10%

 

 

±0.1%

 

 

±0.5%

 

 

WB03(0603)

1/16W

-55 ~ +155℃

50V

100V

±1%

10Ω~332KΩ

±50 , ±100  

  
±5%   
±10%   
           
Operating Voltage V=√(P*R) Overload Voltage V=2.5*√(P*R)    
 
Last Updated ( Saturday, 11 October 2008 11:00 )