Wire Bondable Chip Resistor－WB Series

Features				Applications
Thin film passivated NiCr resistive element				LED constant current application
Tolerance from ±0.1% ~ 10%				Medical Equipment
Extremely Low TCR from ±25 ~ 100ppm/℃				Testing / Measurement Equipment
Wide Resistance Range				Hybrid chip on board circuits
				Multi chip module(MCM) package
				Integrated MMIC


Part Numbering
WB	02	D	T	D	1000	A	A
(1)	(2)	(3)	(4)	(5)	(6)	(7)	(8)

1). Product Type		WB Wire Bondable Chip Resistor				5). TCR		D	±50PPM/℃
2). Dimensions (L×W)		WB01	0.6×0.30mm	0201		5). TCR		E	±100PPM/℃
		WB02	1.0×0.50mm	0402		6). Resistance		0100	10Ω
		WB03	1.6×0.80mm	0603				1000	100Ω
3). Resistance Tolerance		B	±0.1%					2201	2200Ω
		D	±0.5%					1002	10000Ω
		F	±1%			7).Construction		A	Two Bonding Pads
		J	±5%			7).Construction		B	Single Bonding Pads
		K	±10%			8).Electrode		N	Ni / Au
4). Packaging		T	Taping Reel			8).Electrode		A	Aluminum
4). Packaging		B	Bulk

Dimensions
Size	L	W	T	D1
0201	0.6±0.05	0.30±0.05	0.25±0.05	0.15±0.05
0402	1.0±0.05	0.50±0.05	0.30±0.05	0.20±0.10
0603	1.55±0.10	0.80±0.10	0.45±0.10	0.30±0.20

Standard Electrical Specifications
Type	Rating	Operating	Max.Voltage	Max. OV.	Tolance	Resistance	TCR(PPM/℃)
WB01 (0201)	1/32W	-55 ~ +155℃	15V	30V	±0.5%, ±1%	50Ω~42KΩ	±50 ,±100 ,±25
					±5% ,±10%
					±0.1%
					±0.5%
WB02 (0402)	1/16W	-55 ~ +155℃	25V	50V	±1%	10Ω~100KΩ	±50 ,±100 ,±25
					±5%
					±10%
					±0.1%
					±0.5%
WB03(0603)	1/16W	-55 ~ +155℃	50V	100V	±1%	10Ω~332KΩ	±50 , ±100
					±5%
					±10%

Operating Voltage V=√(P*R)				Overload Voltage V=2.5√(PR)

Last Updated ( Sunday, 18 May 2008 11:39 )